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Design of Reflow Soldering Station for Reballing of BGA Packages
Janiš, Adam ; Szendiuch, Ivan (referee) ; Otáhal, Alexandr (advisor)
This thesis deals with the design of a soldering oven for BGA reballing in a nitrogen protective atmosphere. The principles of reflow soldering, the advantages of a nitrogen protective atmosphere on the quality of solder joints and the types of soldering devices are described. The BGA packages´ part consists of their characteristics, assembling methods, a rework and repair process and solder joint inspection methods. Design of the device, as well as heat flow simulations, are included in the experimental part and particularly it also describes the used structural elements and the principle of function of the individual parts of the device. At the end of this work, the soldering process was measured and the ability of the sample soldering was verified.
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Design Of Reflow Soldering Station For Reballing
Of Bga Packages
Janiš, Adam
This article deals with the design of a soldering oven for BGA reballing in a nitrogen atmosphere. The principles of reflow soldering, the advantages of a nitrogen atmosphere regarding the quality of solder joints and the types of soldering devices are described. The main aim of the experimental part is to design the soldering station and to simulate the heat flow during soldering using SolidWorks Flow Simulation. Final stage of this work is based on verification of designed soldering station and optimization of soldering process.
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Design of Reflow Soldering Station for Reballing of BGA Packages
Janiš, Adam ; Szendiuch, Ivan (referee) ; Otáhal, Alexandr (advisor)
This thesis deals with the design of a soldering oven for BGA reballing in a nitrogen protective atmosphere. The principles of reflow soldering, the advantages of a nitrogen protective atmosphere on the quality of solder joints and the types of soldering devices are described. The BGA packages´ part consists of their characteristics, assembling methods, a rework and repair process and solder joint inspection methods. Design of the device, as well as heat flow simulations, are included in the experimental part and particularly it also describes the used structural elements and the principle of function of the individual parts of the device. At the end of this work, the soldering process was measured and the ability of the sample soldering was verified.
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